• image of 内联内存模块插座>10135356-0321K13LF
  • image of 内联内存模块插座>10135356-0321K13LF
10135356-0321K13LF
Inline Memory Module Sockets
AMPHENOL FCI ASIA PTE LTD
10135356-0321K1
-
-
YES

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image of 内联内存模块插座>10135356-0321K13LF
image of 内联内存模块插座>10135356-0321K13LF
10135356-0321K13LF
Inline Memory Module Sockets
AMPHENOL FCI ASIA PTE LTD
10135356-0321K1
-
-
YES
TYPEDESCRIPTION
Contact Plating Gold
Contact Material Copper Alloy
Housing Material Thermoplastic (TP)
Mounting Style PCB Mount
RoHS Details
Maximum Operating Temperature + 85 C
Minimum Operating Temperature - 55 C
Packaging Tray
Type DDR4
Number of Positions 288 Position
Pitch 0.85 mm
Current Rating 0.75 A
Termination Style SMD/SMT
Insulation Resistance 1 MOhms
Key Type Right
Voltage Rating 1.2 V
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