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BGA0004-S
Stencils Template Soldering
Chip Quik Inc.
BGA0004-S datas
-
BGA
YES

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image of 模板焊接>BGA0004-S
image of 模板焊接>BGA0004-S
BGA0004-S
Stencils Template Soldering
Chip Quik Inc.
BGA0004-S datas
-
BGA
YES
TYPEDESCRIPTION
Factory Lead Time 2 Weeks
Package / Case BGA
Material Stainless Steel
Series Proto-Advantage BGA
Published 2012
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type BGA
Number of Positions 100
Pitch 0.039 1.00mm
Outer Dimension 1.300 L x 0.900 W (33.02mm x 22.86mm)
Thickness 0.0040 0.102mm
RoHS Status ROHS3 Compliant
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 原装正品       每颗芯片都来自原厂


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 主要产品       只生厂材料


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 现货库存       只生产原材料

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原装库存Bom 单价格实惠


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